TITLE

Wire connector

PUB. DATE
October 2009
SOURCE
Electrical Wholesaling;Oct2009, Vol. 90 Issue 10, p48
SOURCE TYPE
Trade Publication
DOC. TYPE
Product Review
ABSTRACT
The article evaluates the Twister PRO wire connector from Ideal Industries Inc.
ACCESSION #
45002175

 

Related Articles

  • Q & A: WIRE BONDING.  // SMT: Surface Mount Technology;Apr2003, Vol. 17 Issue 4, p20 

    Answers a query about wire bonding. Causes; Task of analyzing the problems with wire bonding.

  • Shop Digs. Takes, Joanna Werch // Woodworker's Journal;Apr2003, Vol. 27 Issue 2, p98 

    Presents information on a wire bonding machine.

  • Going Mainstream with Chip-on-Board. Luthra, Mukul // Circuits Assembly;Jan2002, Vol. 13 Issue 1, p33 

    Focuses on the wire bonding process of chip-on-board (COB) and integrated circuit packaging in the U.S. Description of COB technologies; Use of ribbon bonding of gallium-arsenide devices in the radio frequency modules; Types of wire bonding.

  • Low-resistance contacts on YBa2Cu3O7-δ ceramics prepared by direct wire bonding methods. Suzuki, Yoshihiko; Kusaka, Tadaoki; Aoyama, Takahiro; Yotsuya, Tsutom; Ogawa, Soichi // Applied Physics Letters;2/13/1989, Vol. 54 Issue 7, p666 

    Wire bonding, such as electric discharge spot welding and ultrasonic bonding, has been investigated for use in simple, conventional methods of preparing low-resistance ohmic contacts on superconducting Y1 Ba2 Cu3 O7-δ ceramics. Spot welding with thermal annealing improves the contact’s...

  • Bonding wire parameters. Greenelsh, Mike // Advanced Materials & Processes;Mar2000, Vol. 157 Issue 3, p51 

    Discusses several issues surrounding the fabrication, shelf life and durability of bonding wire. Elements of bonding wire; Concerns about shelf life; Cause of metallurgical fatigue.

  • Wire and Plastic Play Crucial Roles. Levine, Bernard // Electronic News;04/03/2000, Vol. 46 Issue 14, p52 

    Reports on the announcement on the emerging popularity of wire bonders and laminate plastic integrated circuit packages at the SEMInvest 2000 conference. View of C. Scott Kulicke of Kulicke & Soffa Industries on wirebonding; Comments from Bruce Freyman of Amkor Technology on laminate packages.

  • ChipPAC Stretching Wire Bond Tech. Levine, Bernard // Electronic News;11/25/2002, Vol. 48 Issue 48, p21 

    Reports that the semiconductor assembly and test house ChipPac Inc. has introduced three-row staggered wire bonding technology at 20-micron effective pitch. Advantages of using the technology.

  • Wirebonding to multilevel metal. O'Neill, Peter M.; Eaton, Dennis H. // Solid State Technology;Nov97, Vol. 40 Issue 11, p87 

    Focuses on thermosonic wirebonding and the challenges it face in the integrated circuits (IC) industry. Uses of gold ball wirebonding; History of thermosonic wirebonding technology; Implications of interconnect development for wirebonding.

  • Choosing capillaries for fine pitch bonding. Levine, Lee // Solid State Technology;Jul99, Vol. 42 Issue 7, p115 

    Presents information on the software analysis that has made possible capillary designs which improve wire bond quality. Details on the effects of capillary geometry; Details on Capdesign software; Challenges of bonding at reduced temperatures to wire bond integrity; Conclusion.

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics