TITLE

Alchimer to launch AquiVia process for TSVs midyear

AUTHOR(S)
Flower, Gail
PUB. DATE
February 2009
SOURCE
Electronic News;2/9/2009, Vol. 55 Issue 6, p8
SOURCE TYPE
Trade Publication
DOC. TYPE
Product Review
ABSTRACT
The article evaluates the product AquiVia, which is actually a process used for wet deposition of the insulation and barrier layers inside high-aspect ratio through-silicon vias (TSVs), from Alchimer SA.
ACCESSION #
36626575

 

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