TITLE

IDF China: Intel details new chips, initiatives

AUTHOR(S)
Mutschler, Ann Steffora
PUB. DATE
April 2007
SOURCE
Electronic News;4/23/2007, Vol. 53 Issue 17, p10
SOURCE TYPE
Trade Publication
DOC. TYPE
Proceeding
ABSTRACT
This article discusses highlights of the Intel Developer Forum that was held in Beijing, China in 2007. During the forum, executives from Intel Corp. detailed new products, technology and initiatives meant to allow more security, ease of use and responsiveness between the Internet, computers and consumer electronics devices. In March 2007, Intel announced that it plans to invest $2.5 billion to build China's first 300-millimeter wafer fab in the city of Dalian.
ACCESSION #
24913862

 

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