Revisiting Decade 90: Packaging

Leibson, Steven H.
February 1995
EDN;2/16/95, Vol. 40 Issue 4, p11
Trade Publication
Opinion. Reviews the author's predictions in 1988 regarding changes in the packaging technology for the electronics industry in the 1990s. Use of tape-automated bonding packages for microprocessors; Advances in multichip modules; Features of the coffee-can computer packaging technology developed by Rome Air Development Center.


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