TITLE

Revisiting Decade 90: Packaging

AUTHOR(S)
Leibson, Steven H.
PUB. DATE
February 1995
SOURCE
EDN;2/16/95, Vol. 40 Issue 4, p11
SOURCE TYPE
Trade Publication
DOC. TYPE
Editorial
ABSTRACT
Opinion. Reviews the author's predictions in 1988 regarding changes in the packaging technology for the electronics industry in the 1990s. Use of tape-automated bonding packages for microprocessors; Advances in multichip modules; Features of the coffee-can computer packaging technology developed by Rome Air Development Center.
ACCESSION #
9503146130

 

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