Murphy's Wall

Levenson, David
November 2008
Microlithography World;Nov2008, Vol. 17 Issue 4, p12
Trade Publication
The author discusses Murphy's Wall, the fundamental barrier to doing anything really new. The author explains that the closer one gets to the goal, the faster more and more issues appear. The author says that if the last unexpected problem is overcome, then the project has climbed Murphy's wall. He also stresses that innovations in semiconductor lithography have two additional challenges to overcome. First is Moore's Law and the other challenge is the time and money required to scale up anything to the massive dimensions of the semiconductor industry.


Related Articles

  • Overview of Lithography: Challenges and Metrologies. Levinson, Harry J. // AIP Conference Proceedings;2003, Vol. 683 Issue 1, p365 

    Semiconductor microlithography is rapidly reaching a point where it becomes exceedingly difficult to shrink features at historical rates. We will no longer be able to increase process windows by going to shorter wavelengths with optical lithography, because we are running out of useable...

  • 2001 ITRS metrology roadmap. Diebold, Alain C. // Solid State Technology;Jan2002, Vol. 45 Issue 1, p48 

    Talks about the introduction of technology generations that impose challenge on lithography metrology. Factors complicating the advance of the technology; Purpose of critical dimension (CD) measurements; Potential methods of CD control.

  • Immersion's evolution launches the age of hyper-NA lithography. Wagner, Christian; Kool, Ron; Modderman, Theo; Jasper, Hans; Ronse, Kurt // Solid State Technology;May2006, Vol. 49 Issue 5, p32 

    The article explains that immersion systems in semiconductor lithography allow a more than 50 percent increase in depth of focus (DOF) compared to dry lithography. It has also the advantage of increased critical dimension control, including the potential for mask and simplification because of...

  • EXTREME TECHNOLOGY.  // EDN Europe;Jul/Aug2015, p4 

    The author reflects on the growing popularity of extreme ultraviolet lithography (EUV) in the semiconductor industry. The IMEC convention held in Brussels, Germany, which provided updates from several representatives of the sector regarding the steps towards getting EUV machines into full...

  • Temporary bonding technology improves thin wafer handling. Dragoi, V.; Schaefer, C.; Lindner, P.; Wimplinger, M.; Farrens, S. // Solid State Technology;Mar2004, Vol. 47 Issue 3, p61 

    Reports on the impact of temporary bonding technology on thin wafer handling. Importance of back-thinning of the processed wafers or backside lithography on the processing of compound semiconductors; Implication of the poor mechanical properties of the wafers for a high ratio of wafer breakage...

  • Lithography's future: tougher than ever. Haavind, Robert // Solid State Technology;May2008, Vol. 51 Issue 5, p12 

    The author reflects on the condition of lithography industry, demonstrated at the SPIE Advanced Lithography Conference in San Jose, California. He cites on the emergence of long-shot contenders, such as the multiple e-beam projection of the nanoimprint lithography. Moreover, he stresses that the...

  • US lithography, 1996: The state of the industry. Dunn, Peter N. // Solid State Technology;Jul96, Vol. 39 Issue 7, p175 

    Focuses on the state of the lithography segment of the United States semiconductor industry. Factors that contributed to the continued existence of the lithography industry; History of the industry; Market fragmentation; Technological innovations in the industry.

  • Out of the spotlight: Trends in mainstream lithography. Billat, Susan H. // Solid State Technology;Jul96, Vol. 39 Issue 7, p185 

    Focuses on trends in the lithography segment of the semiconductor industry in the United States. Reticles; Defects in reticles and wafers undergoing lithographic processing; Exposure wavelength; Resist for g-line exposure tools.

  • Immersion in 2006: The industry is halfway in. M. D. L.; E. K. // Solid State Technology;May2006, Vol. 49 Issue 5, p22 

    The article reports that 2006 SPIE Symposium on Microlithography has provided a chance to assess the progress and prospects of liquid immersion exposure before the industry really starts applying it. Nikon, ASML, and some of their customers have reported attaining similar product-quality defect...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics