Component Cleanliness in a No-Clean World

Munson, Terry
March 2003
Circuits Assembly;Mar2003, Vol. 14 Issue 3, p58
Trade Publication
Case Study
Presents a case study that focuses on component residues in the no-clean assembly technology. Effect of component cleanliness on a no-clean assembly single surface-mount reflow process; Key reason for electromigration failures; Several component residues detected on the circuit board.


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