TITLE

Copper thin film of alternating textures

AUTHOR(S)
Huang, Hanchen; Wei, H. L.; Woo, C. H.; Zhang, X. X.
PUB. DATE
June 2003
SOURCE
Applied Physics Letters;6/16/2003, Vol. 82 Issue 24, p4265
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
It is common for thin films to have a predominant texture, but not alternating textures. In this letter, we report a copper film of alternating textures through self-organization. Using dc magnetron (sputtering technique, we deposit copper films on a SiO[SUB2]/Si(111) substrate. A thin layer of copper of copper of 〈111〉 texture is first developed, and another thin layer of 〈110〉 ensued. As deposition continues, a third layer of copper of 〈111〉 texture is formed on the top, leading to a sandwich copper thin film of alternating 〈111〉 and 〈110〉 textures. The film morphology is characterized with scanning electron microscopy and atomic force microscopy and the texture with x-ray diffraction. Based on anisotropic elastic analyses and molecular dynamics simulations, we propose a model of texture evolution during the formation of multilayers, attributing the texture evolution to the competition of surface and strain energies.
ACCESSION #
9987401

 

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