Microscopic mechanisms of ablation and micromachining of dielectrics by using femtosecond lasers

Jia, T. Q.; Xu, Z. Z.; Li, X. X.; Li, R. X.; Shuai, B.; Zhao, F. L.
June 2003
Applied Physics Letters;6/16/2003, Vol. 82 Issue 24, p4382
Academic Journal
We report measurements of damage threshold and ablation depth for SiO[SUB2] and CaF[SUB2] irradiated under lasers at wavelengths of 800 and 400 nm for duration of 45-800 fs. These results can be well understood by using a developed avalanche model. The model includes the production of conduction band electrons (CBEs), laser energy deposition, and CBE diffusion. The evolution of microexplosion is investigated based on this model.


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