TITLE

The Persistent Problem of Tombstoning

AUTHOR(S)
Trip, Harry
PUB. DATE
June 2003
SOURCE
Circuits Assembly;Jun2003, Vol. 14 Issue 6, p20
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Tombstoning of passive chip components during mass reflow soldering process has created problems for circuit assemblers since the beginning of production surface-mount assembly. Early on in surface-mount, tombstoning was a problem usually associated with vapor phase reflow and was attributed to the rapid ramp-up rates characteristic of vapor phase heating, among other causes. One cause of tombstoning is known to be differences in initial wetting of solder between both joints of a passive component. This disparity stems from differences in both the temperature and wettability of the surfaces of both joints.
ACCESSION #
9982328

 

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