The Persistent Problem of Tombstoning

Trip, Harry
June 2003
Circuits Assembly;Jun2003, Vol. 14 Issue 6, p20
Trade Publication
Tombstoning of passive chip components during mass reflow soldering process has created problems for circuit assemblers since the beginning of production surface-mount assembly. Early on in surface-mount, tombstoning was a problem usually associated with vapor phase reflow and was attributed to the rapid ramp-up rates characteristic of vapor phase heating, among other causes. One cause of tombstoning is known to be differences in initial wetting of solder between both joints of a passive component. This disparity stems from differences in both the temperature and wettability of the surfaces of both joints.


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