The Road Ahead for Board Assembly

Dreel, Kirk Van; Chen, Alex
June 2003
Circuits Assembly;Jun2003, Vol. 14 Issue 6, p16
Trade Publication
Several process and equipment developments are needed to keep North American pace with the changing nature of electronics manufacturing. In 2003, the National Electronics Manufacturing Initiative in Herndon, Virginia published its 2002 roadmap, which identifies technology and infrastructure developments required to ensure the competitiveness of the North American electronics manufacturing supply chain. The chapter on board assembly discusses business issues, processes and equipment, materials and issues that cut across several technology areas. This article focuses on anticipated changes in board assembly processes and equipment development required to keep pace with these changes.


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