Dry Solder Joints and Assembly Cleanliness

Hymes, Les
June 2003
Circuits Assembly;Jun2003, Vol. 14 Issue 6, p14
Trade Publication
This article offers answers to questions on various aspects of soldering in surface mounting and electronics assembly industry. To achieve a solder joint between two mating surfaces, liquid solder must wet and flow over those surfaces to form a metallurgical bond. Solder wetting is defined as the formation of a relatively uniform, smooth, unbroken and adherent film of solder to a basis metal. Solderability refers to the characteristic of surfaces being soldered and the ability of a metal surface to be wetted by molten solder.


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