TITLE

Recovery of Copper by Electrodeposition Method from Electroplating Wastewater

AUTHOR(S)
Shuai Fan; Jingsong Wang; Qingwei Guo; Weiming Zhang; Ping Sun
PUB. DATE
September 2014
SOURCE
Applied Mechanics & Materials;2014, Issue 661-662, p141
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Electrodeposition method was applied to recover copper from the simulation of copper-containing electroplating wastewater. Stainless steel plate is used as the cathode and the anode is made of titanium plate coated with RnO2+IrO2, titanium mesh coated with RnO2+IrO2 or stainless steel plate. The electrode potential of copper in electrolyte was calculated, and the effect of initial concentration of copper ions, temperature of electrolyte, voltage, electrode spacing, initial pH value and additive concentration on the recovery of copper was studied in detail. The experimental results showed that the proper anode is titanium plate coated with RnO2+IrO2. Under the condition of initial concentration of copper ions 25g/L, temperature of electrolyte 40°, voltage 3.8V, electrode spacing 25mm, initial pH value 3.60, additive concentration 7.1g/L, the recovery rate of copper can achieve 99.4% and the current efficiency can achieve 88.5%.
ACCESSION #
98646425

 

Related Articles

  • Controlling Copper Electrochemical Deposition (ECD). West, Michael; McDonald, Robert; Anderson, Marc; Kingston, Skip; Mui, Rudy // AIP Conference Proceedings;2003, Vol. 683 Issue 1, p504 

    The implementation of copper processing in semiconductor manufacturing has resulted in major process development and manufacturing challenges. A fundamental understanding of the copper plating processes used in manufacturing has been limited by the lack of in-line methods for direct measurement...

  • Fine Lines in High Yield (Part CXXXVIII): More on Copper Whiskers. Dietz, Carl // CircuiTree;Mar2007, Vol. 20 Issue 3, p42 

    The article focuses on copper whiskers, a plating defect which forms during copper electroplating and can lead to space violations and short circuits. In a particular case, the problem was ultimately traced to the anodes and the non-uniform distribution of phosphorous. The author asserts that...

  • Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell. Wafula, F.; Liu, Y.; Yin, L.; Borgesen, P.; Cotts, E. J.; Dimitrov, N. // Journal of Applied Electrochemistry;Apr2011, Vol. 41 Issue 4, p469 

    quantitative study of the impact of key Cu plating parameters on the voiding propensity of solder joints with Cu electroplated in a commercially available plating solution (CAPS) is performed first on 0.3 cm Cu rotating disk electrode. It is shown that similar to samples plated in a generic...

  • An experimental setup for obtaining metallic multilayer coatings with layers of nanometer thickness. Strukov, G.; Strukova, G.; Shoo, E.; Bozhko, S.; Kabanov, Yu. // Instruments & Experimental Techniques;Sep2009, Vol. 52 Issue 5, p727 

    An automated PC-controlled electrochemical setup for deposition of a specified number of different metal nanodimensional layers onto conducting substrates is described. Metallic layers are deposited in galvanic cells from solutions of corresponding electrolytes on a sample that serves as a...

  • "Mechanical Alloying-Compaction-Electroplating" as Technological Scheme for the Development of Nanocomposite Coatings. POPOV, V. // Acta Physica Polonica, A.;2014, Vol. 126 Issue 4, p1005 

    A novel technique of producing composite electrochemical coatings with non-agglomerated nanodiamond reinforcing particles uniformly distributed in the matrix was developed. The technique is intended for coatings to be applied by transferring material from the anode to the cathode. The anode is...

  • CONSIDERATIONS ON COATINGS OBTAINED BY ELECTROLYTE DEPOSITION MECHANISM. Pasăre, Minodora Maria // Proceedings of the International Multidisciplinary Scientific Ge;2014, Vol. 1, p31 

    Electrolytic deposition is achieved by electrolysis of aqueous solutions of simple or complex salts containing metal ions to be deposited. Piece is coated cathode and anode current source can be an unassailable metal inert (insoluble anode in electrolysis) or metal coating, which dissolves as...

  • Nickel Ion-Selective PVC Membrane Electrode Based on a Newt-Octyl-Calix[6]arene Derivative. Belhamel, Kamel; Ludwig, Rainer; Benamor, Mohamed // Microchimica Acta;Feb2005, Vol. 149 Issue 1/2, p145 

    This study presents a PVC membrane based on 5,11,17,23,29,35-Hexakis-t-octyl-37,38,39,40,41,42-hexakis(N-phenylthiocarbamoylmethoxy)calix[6]arene which is used as an electroactive substance. The electrode reveals a Nernstian response for Ni2+ over a wide pH range with a slope of linear portion...

  • Voids, Part 3. Carano, Michael // Printed Circuit Design & Manufacture;Mar2008, Vol. 25 Issue 3, p18 

    The article discusses voids that are directly attriuted to the electroless deposition process. Voids in the electroless copper deposition can be commonly caused by incorrect or improper maintenance of chemical concentrations or operating parameters. Insufficient amounts of catalyst will reduce...

  • �Anionic effect� in copper plating from sulfate aqueous-ethanolic electrolyte containing cyclic polyester. Kuznetsov, V. V.; Skibina, L. M.; Geshel', S. V.; Loskutnikova, I. N.; Kuznetsova, E. F. // Protection of Metals;Mar2005, Vol. 41 Issue 2, p149 

    It is shown that, in contrast to aqueous electrolytes, where the electrode process is promoted by the electroreduction of activated surface complexes of Cu2+ with SOanions, in aqueous-ethanolic electrolytes, it is promoted by sulfate complexes of copper(II) formed in the solution bulk and...

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics