Deep ultraviolet laser etching of vias in polyimide films

Treyz, G. V.; Scarmozzino, R.; Osgood, R. M.
July 1989
Applied Physics Letters;7/24/1989, Vol. 55 Issue 4, p346
Academic Journal
A deep ultraviolet cw laser has been used to form vias in a polyimide film. The etched features have smooth sidewalls and high aspect ratios. The observations are consistent with an etching mechanism based on thermal decomposition.


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