Intermetallic structure of laser reflowed Cu/Pb-Sn solder joints

Felton, L. E.; Selsley, A. D.; Ficalora, P. J.
May 1989
Applied Physics Letters;5/22/1989, Vol. 54 Issue 21, p2074
Academic Journal
A Nd:YAG laser was used to reflow Cu/Pb-Sn solder joints. The joints were reflowed with 60 W, 1 s laser pulse. The resulting intermetallic microstructure was examined with scanning electron microscopy, energy dispersive x-ray analysis, and x-ray diffraction. In addition to the intermetallic layer expected to form at the solder-base metal interface, an intermetallic precipitate was found to form in the bulk solder. X-ray diffraction data established the identity of the intermetallic as η-Cu6Sn5.


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