Low-resistance contacts on YBa2Cu3O7-δ ceramics prepared by direct wire bonding methods

Suzuki, Yoshihiko; Kusaka, Tadaoki; Aoyama, Takahiro; Yotsuya, Tsutom; Ogawa, Soichi
February 1989
Applied Physics Letters;2/13/1989, Vol. 54 Issue 7, p666
Academic Journal
Wire bonding, such as electric discharge spot welding and ultrasonic bonding, has been investigated for use in simple, conventional methods of preparing low-resistance ohmic contacts on superconducting Y1 Ba2 Cu3 O7-δ ceramics. Spot welding with thermal annealing improves the contact’s resistivity to 2×10-7 Ω cm2 , while a sample without annealing shows non-ohmic and semiconductive characteristics. Change in the crystal structure induced by high current is analyzed. Ultrasonic bonding with annealing at 500 °C achieves 3×10-8 Ω cm2 , one of the lowest contact resistivities ever obtained in simple methods. The current-voltage characteristics show nonlinearity, which is attributed to the superconducting state of the Ag/Y1Ba2Cu3O7-δ interface.


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