New technique and analysis of accelerated electromigration life testing in multilevel metallizations

Muray, L. P.; Rathbun, L. C.; Wolf, E. D.
October 1988
Applied Physics Letters;10/10/1988, Vol. 53 Issue 15, p1414
Academic Journal
Electromigration failure of a series-parallel configuration of aluminum interconnects overlayed on tungsten contacts was measured using a novel multiple lognormal analysis. The analysis examined early failure mechanisms and allowed rapid determination of electromigration parameters on a statistically large number of junctions. The primary failure mode of these stuctures was complete migration of Al off of the W pads. This work suggested that Al/W metallizations, with a large number of series contacts, are prone to short mean time to failures.


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