TITLE

Electromigration studies in amorphous and polycrystalline alloys

AUTHOR(S)
Chisholm, M. F.; Aaron, D. B.; Wiley, J. D.; Perepezko, J. H.
PUB. DATE
July 1988
SOURCE
Applied Physics Letters;7/11/1988, Vol. 53 Issue 2, p102
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
We report the first direct comparisons of electromigration in amorphous and polycrystalline thin-film samples of the same composition. Matched sample pairs of crystalline and amorphous Cu-Ti alloys were subjected to identical test conditions and tested to failure. It was found that the amorphous alloys tested show approximately one order of magnitude improved resistance to electromigration compared to their crystalline counterparts. The improved performance is attributed to the absence of grain boundary migration paths in the amorphous samples. These findings are consistent with earlier work that showed amorphous alloys to be effective diffusion barriers in thin-film metallization systems.
ACCESSION #
9827338

 

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