Supplemental multilevel interconnects by laser direct writing: Application to GaAs digital integrated circuits

Black, Jerry G.; Doran, Scott P.; Rothschild, Mordechai; Ehrlich, Daniel J.
April 1987
Applied Physics Letters;4/13/1987, Vol. 50 Issue 15, p1016
Academic Journal
A nonperturbing sequence of laser direct-writing processes is described for applying supplemental multilevel interconnects on partially or fully fabricated circuits. The approach adds multiple levels of laser direct-written tungsten metallization and is demonstrated here for the assembly of a simple latch circuit on a standard GaAs digital test chip. Principal applications are for subsystem verification, device testing, restructuring, and fault avoidance on Si and GaAs circuits.


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