Metal deposition by electron beam exposure of an organometallic film

Craighead, H. G.; Schiavone, L. M.
June 1986
Applied Physics Letters;6/23/1986, Vol. 48 Issue 25, p1748
Academic Journal
We describe a method of metal deposition by electron beam exposure and pyrolysis of a gold containing organometallic polymer. Commercial gold containing solutions were used as negative electron beam resists with line dose sensitivities of about 0.2 μC/cm as developed in methylene chloride. We have demonstrated the formation of metal patterns on Si, GaAs, and polyimide with linewidths as small as 0.25 μm.


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