High-speed electroplating of copper using the laser-jet technique

von Gutfeld, R. J.; Vigliotti, D. R.
May 1985
Applied Physics Letters;5/15/1985, Vol. 46 Issue 10, p1003
Academic Journal
The laser-jet electroplating technique has been applied to the high-speed deposition of copper at rates up to 50 μm/s. The high plating efficiency of the Cu/Cu++ system makes the deposition rate independent of laser power (unlike that of gold). On the other hand, the morphology of the copper is greatly improved with increasing laser power. Four-point probe measurements for laser-jet copper depositions indicate a resistivity close to that of the published bulk value.


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