Mass spectrometry sampling method for characterizing high-density plasma etching mechanisms

Eddy, C. R.; Leonhardt, D.; Shamamian, V. A.; Butler, J. E.; Thoms, B. D.
May 2003
Applied Physics Letters;5/26/2003, Vol. 82 Issue 21, p3626
Academic Journal
Mass spectrometry sampling using a "through-the-platen" technique is described with respect to its utility in characterizing high-density plasma etching processes for semiconductors. A custom substrate platen/sampling aperture is described and its effectiveness in characterizing plasma/surface reactions is demonstrated. The technique is applied to the characterization of GaAs etching in a Cl[sub 2]/Ar high-density plasma chemistry.


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