TITLE

THERMAL DEFORMATION ANALYSIS OF ALUMINIUM HEAT SINK USING ELECTRONIC SPECKLE PATTERN INTERFEROMETRY

AUTHOR(S)
Retheesh, R.; Radhakrishnan, P.; Singh, Rakesh Kumar; Mujeeb, A.
PUB. DATE
May 2014
SOURCE
International Journal of Advances in Engineering & Technology;May2014, Vol. 7 Issue 2, p431
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
When a solid material is subjected to severe temperature variations, the structure of the material changes and produces a volumetric enlargement which induces stresses in the material. Thermally induced deformation analysis has considerable importance in the mechanical and structural design application of numerous solid materials. The potentially excessive thermally induced distortions can be reduced if one can diagnose the current mechanical state of the material and update the diagnosis at every stage so that stress/strain variations and thereby the fracture may be predicted as an early state as possible. The present work reports a qualitative analysis which directly reflects the situation of thermal deformation of an aluminium heat sink material using out of plane Electronic Speckle Pattern Interferometry (ESPI) setup. The temperature contrast developed on the surface of the sample due to thermal transmittance provides a clear indication of thermal deformation of the specimen. The variation of fringe densities obtained from ESPI images has been taken as a qualitative tool to depict this deformation.
ACCESSION #
97779697

 

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