TITLE

Sematech breakthrough: Using copper on wafers

AUTHOR(S)
McGrath, Dylan
PUB. DATE
August 1997
SOURCE
Electronic News;08/18/97, Vol. 43 Issue 2181, p8
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Announces the production of Sematech Inc.'s first copper metallized wafers. Advantages of using copper on silicon; Concern about aluminum on silicon wafers; Implications for the advancement of the semiconductor manufacturing technology for Sematech members.
ACCESSION #
9708305647

 

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