The package

Levine, Bernard; Guinther, Fred
July 1997
Electronic News;07/14/97, Vol. 43 Issue 2176, p44
Trade Publication
Presents news items related to semiconductor packaging and assembly in the United States. Includes Hyundai Electronics Industries Co. Ltd.'s Semiconductor Assembly & Test Division's order for Kullicke & Soffa gold ball bonders; Assembly and packaging equipment introduced by ASM Pacific Technology Ltd.; Wafer presentation system option for Quad Semiconductor Group's Quad IVcMK2.


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