TITLE

The package

AUTHOR(S)
Levine, Bernard; Guinther, Fred
PUB. DATE
July 1997
SOURCE
Electronic News;07/14/97, Vol. 43 Issue 2176, p44
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Presents news items related to semiconductor packaging and assembly in the United States. Includes Hyundai Electronics Industries Co. Ltd.'s Semiconductor Assembly & Test Division's order for Kullicke & Soffa gold ball bonders; Assembly and packaging equipment introduced by ASM Pacific Technology Ltd.; Wafer presentation system option for Quad Semiconductor Group's Quad IVcMK2.
ACCESSION #
9707250834

 

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