TITLE

Major assembly products coming

AUTHOR(S)
Levine, Bernard
PUB. DATE
June 1997
SOURCE
Electronic News;06/16/97, Vol. 43 Issue 2172, p1
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Focuses on the development of the next-generation of placement gear to support flip chip, ball grid array and other advanced packaging technologies, by semiconductor assembly equipment vendors. Announcements made at the Nepcon East held in Boston, Massachusetts; Eagerness of leading gear firms to cash in on the advanced packaging integrated circuit placement market.
ACCESSION #
9707114583

 

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