Major assembly products coming

Levine, Bernard
June 1997
Electronic News;06/16/97, Vol. 43 Issue 2172, p1
Trade Publication
Focuses on the development of the next-generation of placement gear to support flip chip, ball grid array and other advanced packaging technologies, by semiconductor assembly equipment vendors. Announcements made at the Nepcon East held in Boston, Massachusetts; Eagerness of leading gear firms to cash in on the advanced packaging integrated circuit placement market.


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