TITLE

Licensing pack

PUB. DATE
January 1997
SOURCE
Electronic News;1/13/97, Vol. 43 Issue 2150, p4
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Anticipates Hadco's signing of a license agreement with International Business Machines Corp. (IBM) allowing it to produce micro vias using IBM's Surface Laminar Circuit.
ACCESSION #
9702036911

 

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