Avoiding Board Bounce

King, Phil; Balzer, Ray
May 2003
Circuits Assembly;May2003, Vol. 14 Issue 5, p40
Trade Publication
Addresses root causes of digital noise and test inability during in-circuit digital testing of integrated circuit packages. Source of signal fidelity problems; Cause of occurrence of ground bounce experienced during in-circuit digital testing; Ways to reduce simultaneous switching problems in boundary-scan tests.


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