TITLE

Avoiding Board Bounce

AUTHOR(S)
King, Phil; Balzer, Ray
PUB. DATE
May 2003
SOURCE
Circuits Assembly;May2003, Vol. 14 Issue 5, p40
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Addresses root causes of digital noise and test inability during in-circuit digital testing of integrated circuit packages. Source of signal fidelity problems; Cause of occurrence of ground bounce experienced during in-circuit digital testing; Ways to reduce simultaneous switching problems in boundary-scan tests.
ACCESSION #
9701178

 

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