Investigating 0201 Printing Issues and Stencil Design
- Aging Characteristics of Immersion Tin Surface Finishes. Metzger, Dieter; Vogel, Roland // Circuits Assembly;Dec2003, Vol. 14 Issue 12, p38
The technology of surface finishes for printed circuit boards (PCB) is seeing a dramatic shift from hot air solder leveling (HASL) toward alternative finishes like immersion tin. This trend is caused by the worldwide environmental pressure to stop using lead for electronic assemblies and by the...
- Reflow Soldering for the Radio Amateur. Koehler, Jim // QST;Jan2011, Vol. 95 Issue 1, p32
In the article, the author discusses how to use the reflow soldering method in an amateur setting or at home. He claims that reflow soldering is the simplest approach of producing surface mount printed circuit (PC) boards of various modern electronic equipment like radios, computers and MP3...
- A Bumpy Trip for Solder Bumping. Riley, George A. // Advanced Packaging;Nov2005, Vol. 14 Issue 11, p36
The article looks at the strengths and weaknesses of contending lead-free solder bumping processes. It describes evaporated bumps, electroplating, stencil printing, solder transfer bumping, sphere deposition, and C4NP system. A chart predicts the 5-year year forecast of solder-bumped flip chip...
- Speedline Improves Screen Printing Throughput. Flower, Gail // SMT: Surface Mount Technology;Sep2004, Vol. 18 Issue 9, p4
Describes Speedline Technologies Inc.'s efforts to improve the stencil printing and soldering processes to reduce surface mount assembly defect opportunities. Enhancement of the design, operation and optimization of the processes; Speedline's work with Georgia Tech to implement closed-loop...
- Cleanliness is Critical for Wafer Bump Stencil Printing. Bixenman, Mike; Konrad, Michael // Advanced Packaging;Jul2004, Vol. 13 Issue 7, p43
Focuses on the use of stencil or screen printing solder paser for surface mounted components. Importance of cleanliness of the stencil for the success of the bumping process; Delivery of the amount of solder paste; Integration of the cleaning agent with the cleaning equipment.
- Reliability Effects of Unfilled Underfill Encapsulants. Loh, Karl; Ibe, Edward // SMT: Surface Mount Technology;Feb2005, Vol. 19 Issue 2, p46
Examines the effect of an unfilled underfill encapsulant on board-level reliability of area array package. Advancement in the use of undefill encapsulant towards the encapsulation of surface mount components; Solder joint reliability against mechanical shock; Improvement in thermal cycle...
- The 'Other' Mixed Technology. Mohanty, Rita // Circuits Assembly;Nov2008, Vol. 19 Issue 11, p22
The article discusses several advantages and disadvantages of various approaches to dynamic or broadband printing in the surface mount industry. Dynamic or broadband printing refers to the process of meeting the solder paste need of larger and smaller components on the same board while using...
- Component Rework: A Small World and Getting Smaller. Walz, Mark J. // Circuits Assembly;Jan2003, Vol. 14 Issue 1, p32
Focuses on reworking and repairing of micro surface mount devices using various techniques and tools. Dimensions of the electronic board used in the study; Sequences in the rework process; Development of rework thermal process; Removal of defective components.
- Low-temperature solders. Mei, Zequn; Holder, Helen A. // Hewlett-Packard Journal;Aug96, Vol. 47 Issue 4, p91
Discusses the application of low-temperature solders in surface mount assembly processes for products that do not come in contact with harsh temperatures. Thermal shock reduction; Selection of low melting alloys; Wetting and solderability; Reliability and long-term stability; Thermal fatigue.