Investigating 0201 Printing Issues and Stencil Design

Wang, Mei; Geiger, David; Nakajima, Kazu; Shangguan, Dongkai; Ho, C. C.; Yi, Sammy
May 2003
Circuits Assembly;May2003, Vol. 14 Issue 5, p30
Trade Publication
Investigates printed circuit boards design and assembly processes on 0201 packages. Components of a test vehicle designed for the 0201 process evaluation; Types of stencil technologies tested in the experiment; Solder paste used in the work; Parameters identified for printer optimization.


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