TITLE

EKRA Joins SECAP

PUB. DATE
May 2003
SOURCE
Circuits Assembly;May2003, Vol. 14 Issue 5, p12
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Reports that EKRA, a provider of screen printing and material deposition technology, has joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP). Critical aspects of solder bumping; Importance of printing and electroplating technologies for SECAP.
ACCESSION #
9701138

 

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