TITLE

France Telecom, SGS in move to 0.25-micron

PUB. DATE
November 1996
SOURCE
Electronic News;11/25/96, Vol. 42 Issue 2144, p18
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Reports that France Telecom-CNET and SGS-Thomson Microelectronics have already processed first wafers using a 0.25-micron drawn CMOS process and 0.20-micron effective gate length. Utilization of the process to manufacture integrated circuits for high-speed applications; Remarks from SGS-Thomson corporate vice-president of research and development Joel Monnier.
ACCESSION #
9612103662

 

Related Articles

  • Satellite links hit turbopower. Dipert, Brian // EDN;06/05/2000, Vol. 45 Issue 12, p26 

    Reports on STMicroelectronics Inc.'s signing of a license agreement to use France Telecom SA's Turbo Code forward-error-correction patents. STMicroelectronics' development of a digital-broadcast satellite reception chip; Use of the technology in the development of the chip; Contact information.

  • SGS-Thomson confirms plan for Singapore fab; 0.5-micron work to start late `98.  // Solid State Technology;Aug96, Vol. 39 Issue 8, p48 

    Reports on SGS-Thomson Microelectoronics NV's plan to build a second semiconductor wafer factory in Singapore. Projected capacity of the factory.

  • Forward Error-Correction Will Greatly Boost Comm Capacity. Vollmer, Alfred // Electronic Design;06/26/2000, Vol. 48 Issue 13, p36 

    Focuses on the licensing of an error-correction code from France Telecom SA to STMicroelectronics Inc. Capacity of the code for broadcasting two high definition television stream channels.

  • Euro briefs.  // Solid State Technology;Jan97, Vol. 40 Issue 1, p38 

    Summarizes news topics pertaining to companies in the semiconductor industry in Europe as of January 1997. Features of wafers developed by SGS-Thomson Microelectronics and France Telecom-CNET; Construction plans for fabrication plant in Dresden, Germany by Motorola and Siemens; Acquisition by...

  • Europe.  // Solid State Technology;Feb97, Vol. 40 Issue 2, p32 

    Reports on developments in the semiconductor industry in Europe. Successful processing of the first wafers in the next generation technology by France Telecom-CNET and SGS-Thomson Microelectronics; Order received by Jenoptik Infab from Anam Industrial Co. Ltd.; Align-Rite International's...

  • Boosting production output by outsourcing CMP. Nguyen, Hoang; Goulding, Mike; Gandy, Todd; Baker, Kevin; Ebbs, Kirk; Rhoades, Robert L. // Solid State Technology;Jan2007, Vol. 50 Issue 1, p56 

    The article discusses the outsourcing chemical mechanical planarization (CMP) process module as it boosts production output from an existing wafer fabrication. STMicroelectronics has outsourced a portion of its CMP processing to Entrepix as an effective alternative to installing more in...

  • Who is doing what with supplier-to-fab e-diagnostics. Burggraaf, Pete // Solid State Technology;Sep2002, Vol. 45 Issue 9, p38 

    Focuses on different semiconductor equipment and materials suppliers' use of e-diagnostics to improve wafer fabrication and tool efficiency. IBM Corp.'s installation of 300mm fabrication with full e-diagnostics capability; STMicroelectronics NV' use of chemical vapor deposition, physical vapor...

  • Bigger fabs for memory firms. Manners, David // Electronics Weekly;8/15/2007, Issue 2300, p15 

    The article reports that the memory and foundry firms are building bigger fabs while broadline semiconductor firms such as NXP, STMicroelectronics NV, Texas Instruments, Freescale and Infineon are on the way to becoming fab-lite. Now "megafabs" capable of producing 100,000 to 210,000 wpm or one...

  • Philips, ST and TSMC in 300mm wafer link up.  // Electronics Weekly;2/27/2002, Issue 2041, p1 

    Reports on the research and development program for 300-millimeter wafers and deep sub-micron wafer processing set up by Philips Semiconductors, STMicroelectronics and TSMC. Implication of the high costs of the project.

Share

Read the Article

Courtesy of VIRGINIA BEACH PUBLIC LIBRARY AND SYSTEM

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics