TITLE

Monitoring plasma damage: A real-time, noncontact approach

AUTHOR(S)
Hoff, A.M.; Esry, T.C.
PUB. DATE
July 1996
SOURCE
Solid State Technology;Jul96, Vol. 39 Issue 7, p139
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Reports on the results obtained while using a new monitoring approach for real-time and noncontact diagnostics of plasma damage at two independent semiconductor wafer-fab locations. Generation of whole-wafer maps; Modes of plasma damage; Measuring charge effects; Surface photovoltage measurement.
ACCESSION #
9607263530

 

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