Through-Hole Automation Challenges

Giangrieco, John
April 2003
Circuits Assembly;Apr2003, Vol. 14 Issue 4, p47
Trade Publication
The article presents an approach to automate through-hole. A new radio frequency (RF) application using mature through-hole technology requires several design changes, including insertion angles and clinching techniques, to optimize board functionality and reduce solder bridging. One user had specific requirements outside the design standards. The product needed to integrate RF signals, control electromagnetic energy within the circuit and use radial components. Some possible alternatives were to place the delicate components manually or to convert the design to a surface-mount design. The challenge was to overcome was the potential solder bridging of the components once the leads were cut and clinched in the boards.


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