Selecting Solder Mask Material

Rusli, Sukianto; Huemoeller, Ron
April 2003
Circuits Assembly;Apr2003, Vol. 14 Issue 4, p34
Trade Publication
The article explains the procedure on how to avoid falling in the cracks. A material stress analyzer (MSA) was developed to allow us to measure the solder mask performance under various stresses and processing conditions by employing elements of standard three-point bend methodologies, among other analytical techniques. The MSA was designed to quantitatively and qualitatively measure the effects of stress/strain relationships on solder mask to resultant cracking. Deflection and visual data reflect the fundamental characteristic of solder mask properties such as modulus, film strength and film elongation.


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