Selective Soldering--The Future is Now

Zarrow, Phil; Klenke, Bob
April 2003
Circuits Assembly;Apr2003, Vol. 14 Issue 4, p16
Trade Publication
The article analyzes the effectiveness of wave soldering.The first choice of many practitioners is to see if intrusive soldering (such as reflow of through hole, paste-in-hole or pin-in-paste) is applicable. With modern convection-dominant reflow ovens, intrusive soldering depends on whether the components can survive the incurred thermal excursions of the reflow profile. The most common method of selective soldering uses masking pallets. Selective soldering falls into two categories: PCBA-level and micro soldering. Selective soldering allows users to optimize the solder process down to the pin level verses the compromise techniques in flux application and contact time that occur with wave soldering. Selective soldering is also friendly to the environment since its flux and solder usage and emission levels are significantly less than wave soldering. The biggest advantage selective soldering offers is the ability to reduce solder defects, thus improving first pass yields.


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