Asymtek to Equip Lee Air Aircraft Electronics Facility

April 2003
Circuits Assembly;Apr2003, Vol. 14 Issue 4, p8
Trade Publication
Lee Air Inc., a designer and manufacturer of aircraft electronics, purchased an Asymtek Automove A-402 dispensing system for its aviation electronics facility. According to a statement from Asymtek, Lee Air previously used a screen printer to apply solder paste on its printed circuit boards, but the unique shape of its boards led Lee Air to discontinue stenciling in favor of dispensing. As a manufacturer of critical electrical controllers and accessories for the aviation industry, Lee Air's priority is consistent, repeatable paste deposition. Lee Air has customized a dispensing program to control the amount of solder paste dispensed on their products.


Related Articles

  • NEPCON East Product SPOTLIGHT.  // Circuits Assembly;May2002, Vol. 13 Issue 5, p53 

    Evaluates several products and equipment related to printed circuits in the U.S. Use of AsahiKlin AK-225 for removing flux-residue from circuit boards; Capabilities of S8 APO stereomicroscope; Advantages of NC253 pin probeable, no-clean solder paste.

  • Product SPOTLIGHT.  // Circuits Assembly;Nov2002, Vol. 13 Issue 11, p47 

    Focuses on products manufactured by NEPCON West which are used in printed circuit assembly operation. Application of a no-clean solder paste called NC253 in assembly processes and pin testing applications; Features of Kestrel two-axis, a non-contact measuring system; Characteristics of the RLE...

  • Optimizing Printer-Based Solder Paste Inspection. Morini, John; Cronin, John; O'Neal, Dennis // Circuits Assembly;Mar2002, Vol. 13 Issue 3, p32 

    Examines the optimizing printer-based solder paste inspection with statistical process control (SPC). Influence of SPC on the quality and profitability of printed circuit board; Tolerance level for defects of production in electronic manufacturing industry; Lists of software tools and data...

  • Machine Versatility. Mohanty, Rita // Circuits Assembly;Oct2007, Vol. 18 Issue 10, p20 

    The article discusses various factors to consider when assessing the versatility of circuit printers. Buyers should pay attention to the frame construction, as it affects the stability of various movements during the printing operation. The ideal base should be made of steel or other durable...

  • Type-4.5. Yu, Michael // CircuiTree;Jan2011, Vol. 24 Issue 1, p29 

    The article focuses on the effectiveness of type 4.5 solder paste in meeting the high reliability and fatigue-strength demands of high-density printed circuit boards (PCBs) with mixed technology devices. Aside from increasing the solder-paste depositing volume for the large pads of surface mount...

  • Intrusive Reflow of Lead-free Solder Paste. Coleman, William E.; Oxx, George // SMT: Surface Mount Technology;Nov2007, Vol. 21 Issue 11, p18 

    The article discusses a study which aims to develop a stencil design or printing process to apply solder paste in and around the thru-hole. Intrusive reflow is the process of printing solder paste in and around the thru-hole. In this experiment, a resistor, stencils, thick boards and thru-hole...

  • Your Local PCBA Needs Your Support. Zarrow, Phil // Circuits Assembly;Dec2003, Vol. 14 Issue 12, p16 

    In the printing process, proper printed circuit boards (PCB) support is necessary for accurate solder paste transfer. If the PCB is not supported to minimize deviation from flatness, much of that inherent accuracy is lost. Paste transfer and the thickness and definition of the print will be...

  • Resolving Pad Design Defects With Destructive and Non-Destructive Methods. Zhen (Jane) Feng; Hung Le; Chung, Roy; Tran, Raymond; Sati Johal; Murad Kurwa // CircuiTree;Jan2010, Vol. 23 Issue 1, p16 

    The article discusses a study which examined the destructive and non-destructive methods used to resolve pad defects. The authors state that effective testing methods are important to identify common defects such as voids and short circuits. They also mention that the Solder Paste Inspection...

  • Control the Print Process; Safeguard Productivity. Johnson, Dick // SMT: Surface Mount Technology;Mar/Apr2010, Vol. 25 Issue 2, p6 

    The article discusses the importance of controlling the solder paste printing in single and unified process control system to achieve suitable outputs and yields of printed circuit boards (PCBs). The author emphasized that the system can maintain the specified printing specifications of products...


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics