TITLE

Two Packaging Solutions for High Temperature SiC Diode Sensors

AUTHOR(S)
Brezeanu, G.; Draghici, F.; Badila, M.; Craciunoiu, F.; Pristavu, G.; Pascu, R.; Bernea, F.
PUB. DATE
March 2014
SOURCE
Materials Science Forum;2014, Vol. 778-780, p1063
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
A partially electrically isolated package with a gold wire and fully isolated solution with a metallic piston, respectively, are designed and tested for high temperature sensors (400° C) based on SiC Schottky barrier diodes (SBD). Electrical behavior and sensor performance are very close for both packaging solutions. The stress due to contact pressure and higher cost are some disadvantages for pressure contact technology.
ACCESSION #
94903247

 

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