TITLE

3D Chips Challenge Industry, Report Says

AUTHOR(S)
Manners, David
PUB. DATE
February 2003
SOURCE
Electronic News;2/3/2003, Vol. 49 Issue 5, pN.PAG
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Looks at the technical challenges faced by the chip industry in the U.S. Companies that have been pioneering three-dimensional techniques with technologies that allow functional circuits to be transferred from wafer to wafer; Major concern for the industry.
ACCESSION #
9383388

 

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