TITLE

Cypress, Honeywell Embark On Radiation Hardened Chip Venture

PUB. DATE
December 2002
SOURCE
Electronic News;12/16/2002, Vol. 48 Issue 51, pN.PAG
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Reports on the plan of Honeywell International Inc. and Cypress Semiconductor Corp. to jointly develop a technology for integrated circuits used in satellites, strategic missiles and other space vehicles. Function of Honeywell's technology; Significance of the partnership to both companies; Focus of Honeywell's chipmaking efforts.
ACCESSION #
9383002

 

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