TITLE

Thin Wafers from Swiss Company Styled for Smart Clothes

AUTHOR(S)
Ball, Richard
PUB. DATE
March 2003
SOURCE
Electronic News;3/17/2003, Vol. 49 Issue 11, pN.PAG
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Reports on the semiconductor wafer thinning service offered by EM Microelectronic. Methods used in thinning the wafer; Potential applications for thinned wafers; Advantages of thin wafers.
ACCESSION #
9346853

 

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