TITLE

3D Integrated Circuits Show Extreme RF Potential

AUTHOR(S)
DELISLE, JEAN-JACQUES
PUB. DATE
December 2013
SOURCE
Microwaves & RF;Dec2013, Vol. 52 Issue 12, p40
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
The article discusses various developments related to the Radio Frequency (RF), integrated-circuit (IC) and semiconductor industries. It presents an overview of three-dimensional (3D) ICs, which have potential power, cost, space, processing time and interconnect reductions for high-performance applications. It is noted that 25 million Euros have been spent by AMS AG in an analog 3D IC process expansion.
ACCESSION #
93425032

 

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