Finding BGA Opens in Production

Leinbach, Glen
March 2003
Circuits Assembly;Mar2003, Vol. 14 Issue 3, p36
Trade Publication
Focuses on techniques to detect open solder joints. Increase in the use of complex integrated circuits on the printed circuit board (PCB); Implementation of ball grid array (BGA) form of packaging method; Introduction of automated x-ray inspection (AXI) for solder paste prints; Information about solder balls on the PCB; Use of AXI in conjunction with BGA to detect open joint; Reasons for the variation in solder ball dimensions.


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