Reflow Atmospheres in the Lead-Free Era
- Copper Dissolution in Tin. Turbini, Laura J. // SMT: Surface Mount Technology;Feb2007, Vol. 21 Issue 2, p8
The article reflects on substitution of lead solders with tin concentrated solders that require high processing temperatures. It observes that in the lead-free solders, the percentage of tin is almost 95 to 99% and at such high tin concentration, the amount of copper diffuses into the solder...
- The Year in Review: The Good, Bad and Ugly. Kenyon, William G. // SMT: Surface Mount Technology;Dec2005, Vol. 19 Issue 12, p8
The article focuses on the issues faced by the electronics industry. Many resources have been expended to accomplish the elimination of lead from the palette of soldering materials. Nine of the ten participating member countries have completed voting on the Draft International Standard (DIS)...
- Cost of Lead Free Solder Materials. // Adhesives & Sealants Industry;Jul2007, Vol. 14 Issue 7, p37
The article aims to develop a cost comparison of soldering materials used in the shifting from tin or lead to lead-free soldering. The author discusses metal costs and density versus volume of lead-free and tin lead solders. He also discussed the manufacturing challenges and applies these issues...
- Reflow Soldering with a SnCu Eutectic Pb-Free Alloy. Diepstraten, Gerjan // Circuits Assembly;Sep2008, Vol. 19 Issue 9, p34
The article presents information on reflow soldering with a SnCu eutectic lead-free alloy. SnCuNi refers to an established no-silver lead-free alloy for wave soldering applications. The alloys were not of interest for reflow soldering when lead-free was introduced due to their high melting...
- The New 'Mixed Technology' PCB. Shea, Chrys // Circuits Assembly;Jul2007, Vol. 18 Issue 7, p58
The article discusses the phasing out of the tin-lead (SnPb) ball grind array (BGA) packages in circuit assembly. The author notes that this issue presents assemblers a challenge in meeting production commitments. In response, the author elaborates on several recommendations that include a...
- Fab Workarounds, Part 2. Shea, Chrys // Circuits Assembly;Jun2008, Vol. 19 Issue 6, p39
The article deals with wave solder issues. It states that although the undercured solder mask is not often noted, it is still occasionally reported. If undercured mask creates wave-soldering issues, frequently they can be solved by simply completing the cure cycle. Blowholing issues are often...
- Using Solder Fountains. Ferry, Jeff // Circuits Assembly;Nov2001, Vol. 12 Issue 11, p60
Focuses on an increase in usage of solder fountains with the introduction of lead-free solders. Pros and cons of solder fountain; Steps to be followed in working with solder fountains; Rework tips to be followed when working with solder fountain.
- Death of a Battery. Munson, Terry // Circuits Assembly;Nov2001, Vol. 12 Issue 11, p61
Focuses on hand soldering process. Causes of faults in the soldered product; Usage of weal organic acids as fluxes; Appropriate amount of flux to be used in soldering.
- Concerned About Stencil Life? Hymes, Les // Circuits Assembly;Jan2003, Vol. 14 Issue 1, p20
Presents guidelines for determining the estimated lifetime of solder paste stencils. Causes of damage of the stencils; Tips on cleaning of the stencils.