TITLE

Reflow Atmospheres in the Lead-Free Era

AUTHOR(S)
Mackie, Andy C.
PUB. DATE
March 2003
SOURCE
Circuits Assembly;Mar2003, Vol. 14 Issue 3, p26
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Examines effects of several process variables on lead free solder pastes. Need for a consistent joint quality across a printed circuit board (PCB) in implementation of lead-free assembly; Four variables that were tested in the examination of damage sensitivity; Two factors that limit maximum temperature that a PCB assembly can tolerate; Three problems associated with flux residues from solder materials; Relation between surface tension and solderability.
ACCESSION #
9279683

 

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