How Long Until the Next Killer Application?

Vardaman, E. Jan
March 2003
Circuits Assembly;Mar2003, Vol. 14 Issue 3, p22
Trade Publication
Focuses on developments in the commercial use of semiconductor packaging technology. Contribution of the chip-scale packages technology in the making of mobile phones; Need for integrated circuit packages to adopt miniature size and enhanced functionality; Brief information about use of the wafer-level packages in mobile phones; Details regarding time taken for commercialization of high definition televisions.


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