TITLE

How Long Until the Next Killer Application?

AUTHOR(S)
Vardaman, E. Jan
PUB. DATE
March 2003
SOURCE
Circuits Assembly;Mar2003, Vol. 14 Issue 3, p22
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Focuses on developments in the commercial use of semiconductor packaging technology. Contribution of the chip-scale packages technology in the making of mobile phones; Need for integrated circuit packages to adopt miniature size and enhanced functionality; Brief information about use of the wafer-level packages in mobile phones; Details regarding time taken for commercialization of high definition televisions.
ACCESSION #
9279677

 

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