TITLE

Stresses and opportunity behind today's advanced-IC package proliferation

PUB. DATE
March 2003
SOURCE
Solid State Technology;Mar2003, Vol. 46 Issue 3, p36
SOURCE TYPE
Trade Publication
DOC. TYPE
Article
ABSTRACT
Focuses on the integrated circuit package proliferation in the semiconductor industry. Combination of design complexity and costs; Response to the customer demand; Need for comprehensive applications engineering.
ACCESSION #
9244983

 

Related Articles

  • Semiconductor industry faces possible end of Moore's Law. Bronstad, Amanda // Business Press;02/12/99, Vol. 11 Issue 42, p23 

    Focuses on developments related to semiconductor industry as of February 12, 1999. Market analysts' prediction of possible end of the Moore's Law; Technological challenges faced by the industry; Changes in microcomputer chips.

  • Alliance will promote integrated chips. Kalin, Sari // InfoWorld;09/09/96, Vol. 18 Issue 37, p34 

    Reports on the alliance of 36 semiconductor companies that will make it easier for them to pack more functions on a single chip. Development of standards; Integration of cores.

  • Chip fabs eye increased production. Knowles, Anne // eWeek;07/17/2000, Vol. 17 Issue 29, p11 

    Focuses on the introduction of a range of equipment by seminconductors manufacturers in the United States which are capable of producing microchips which are 300 millimeter. Cost-effectiveness of the equipment according to industry leaders; Delays in chip orders prompting many semiconductor...

  • Is chipmaking skill still a differentiator? Haavind, Robert // Solid State Technology;Sep2001, Vol. 44 Issue 9, p14 

    Editorial. Highlights the importance of integrated circuit proficiency in the semiconductor market. Benefits of integrated circuits; Reason for the capital spending increase of Intel; Relation between the design and fabrication cycle of integrated circuits.

  • The expanding market for microdisplays. Thornell, Maya // Solid State Technology;Dec2001, Vol. 44 Issue 12, p32 

    Reports on the increased focused by the semiconductor industry on research and development and production of microdisplay technology. Forecast on the growth of worldwide market for microdisplays; Discussion on microdisplay chips; Applications of microdisplays.

  • The circuit. Hardie, Crista; MacLellan, Andrew // Electronic News;01/20/97, Vol. 43 Issue 2151, p21 

    Reports on developments related to integrated circuit manufacturing in the United States as of January 20, 1997. Includes Unitrode Corp.'s BiCMOS PWM controller; Linfinity Microelectronics' Linfinity Area Technology Center (LATC) in Singapore; Checkpoint Systems' alliance with Shore to Shore to...

  • The fab line. Erkanat, Judy; Bradley, Gale // Electronic News;01/20/97, Vol. 43 Issue 2151, p26 

    Reports on developments related to integrated circuit manufacturing in the United States as of January 20, 1997. International 300mm Initiative's selection of Nanometrics to supply an advanced design metrology tool; FSI International's order to provide chemical management equipment and support...

  • new products: Integrated Circuits.  // EDN Europe;Aug2001, Vol. 46 Issue 8, p65 

    Presents several integrated circuit products of semiconductor industry as of August 2001. Features of Smart-card Controller from Hitach Europe; Performance capabilities of LVDS Signaling from Fairchild Semiconductor; System requirements for Serial EEPROMs from Catalyst Semiconductor.

  • Warning Signs of an IC Slowdown. McClean, Bill // Electronic News;01/08/2001, Vol. 47 Issue 2, p26 

    Offers a look at the integrated circuit (IC) industry cycles from 1971 up to 2001. Description of the cycles.

Share

Read the Article

Courtesy of THE LIBRARY OF VIRGINIA

Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics