Solving a BGA Footprint Mismatch
- Reliability Relationships. Ferry, Jeff // Circuits Assembly;Feb2002, Vol. 13 Issue 2, p51
No abstract available.
- Jumpering in Difficult Areas. Wong, Marvin; Yeh, Albert // Circuits Assembly;Jan2003, Vol. 14 Issue 1, p42
Evaluates printed circuits assembly (PCA) employing mechanical and electrical performance specifications. Problems faced during the production of PCA; Investigation of several potential techniques in the solution phase; Illustration of a ceramic ball grid array flex circuit patch assembly process.
- Updated Results of BGA Tensile Testing with ALTERNATIVE PCB FINISHES. Houghton, Bruce // PC FAB;Nov2001, Vol. 24 Issue 11, p30
Part II. Reports on the updated results of BGA tensile testing with alternative printed circuit board finishes. Use of performed high-melt solder ball; Strength of the solder joints; Variation of pull strength.
- Back-to-Back BGA Routing. Voss, Bernard // Printed Circuit Design;Jan2003, Vol. 20 Issue 1, p16
Discusses the routing of ball grid arrays (BGA) to successfully design dense printed circuits. Printed circuit board construction that provides a single microvia directly beneath the BGA; Signal impedance control, device power delivery and signal return path requirements engineered into BGA...
- Designing With BGAs. Pulliam, Wayne // Printed Circuit Design;Mar2002, Vol. 19 Issue 3, p30
Focuses on designing printed circuit boards that utilize ball grid array (BGA) packages. Techniques in designing boards with the use of BGA; Details of the power distribution capabilities of BGA; Information on the use of copper fills, power trace widths and solder mask; Benefits of...
- Don't Overlook the Details. Hymes, Les // Circuits Assembly;Aug2003, Vol. 14 Issue 8, p31
This article discusses about what should be done to stop micro-etch disintegration and deal with global standards in circuits assembly industry. These standards for newer devices, such as ball grid arrays, are generally the same throughout the industry, providing for land pattern commonality....
- Anatomy of a Correct THERMAL PROFILE. ILUSTRE, SIMON // Circuits Assembly;Oct2009, Vol. 20 Issue 10, p30
The article explains the anatomy of the correct thermal profile of BGA-laden printed circuit boards (PCB) and offers guidelines for optimum temperature settings relating to a particular solder paste. It outlines the steps for setting up temperatures of a double-sided, ball grid array...
- Top 10 BGA Breakout Tips. PFEIL, CHARLES // Printed Circuit Design & Manufacture;Feb2009, Vol. 26 Issue 2, p16
The article looks at the most important ideas for fanout and routing of ball grid arrays (BGAs). According to the author, aligning blind vias in columns and rows is the most effective way of increasing the route density. He says that spreading the vias within the pads will potentially open up a...
- Next-Generation Laser Rework. Farrell, Robert; Wang, Paul P.E. // Circuits Assembly;Aug2003, Vol. 14 Issue 8, p22
This article compares the latest generation laser rework platform with a common forced convection platform. Many ball grid arrays (BGAs) and microBGAs are reworked using forced convection rework platforms capable of replacing BGAs with a reliability that meets or exceeds that of the original...