TITLE

Electroless metal discharge layers for electron beam lithography

AUTHOR(S)
Dobisz, Elizabeth A.; Bass, Robert; Brandow, Susan L.; Chen, Mu-San; Dressick, Walter J.
PUB. DATE
January 2003
SOURCE
Applied Physics Letters;1/20/2003, Vol. 82 Issue 3, p478
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
We report a method for fabrication of continuous, conformal, ultrathin (i.e., 15-30 nm) Cu films using a room temperature, aqueous-based, electroless deposition technique on silica and polymer planarizer surfaces. The Cu films are sufficiently homogeneous, electrically conductive, and optically transparent for use as resist discharge layers during e-beam patterning of the substrate. The grounded Cu film, deployed here as a resist underlayer, eliminates the 0.1-0.4 μm subfield stitching errors normally observed in the absence of the Cu film during resist patterning on a glass or insulating substrate. The Cu is readily removed using a nitric acid wet etch following patterning.
ACCESSION #
8926037

 

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