Electroless metal discharge layers for electron beam lithography

Dobisz, Elizabeth A.; Bass, Robert; Brandow, Susan L.; Chen, Mu-San; Dressick, Walter J.
January 2003
Applied Physics Letters;1/20/2003, Vol. 82 Issue 3, p478
Academic Journal
We report a method for fabrication of continuous, conformal, ultrathin (i.e., 15-30 nm) Cu films using a room temperature, aqueous-based, electroless deposition technique on silica and polymer planarizer surfaces. The Cu films are sufficiently homogeneous, electrically conductive, and optically transparent for use as resist discharge layers during e-beam patterning of the substrate. The grounded Cu film, deployed here as a resist underlayer, eliminates the 0.1-0.4 μm subfield stitching errors normally observed in the absence of the Cu film during resist patterning on a glass or insulating substrate. The Cu is readily removed using a nitric acid wet etch following patterning.


Related Articles

  • Integration of thin electroless copper films in copper interconnect metallization. Webb, E.; Witt, C.; Andryuschenko, T.; Reid, J. // Journal of Applied Electrochemistry;Mar2004, Vol. 34 Issue 3, p291 

    Deposition of a thin electroless copper films on PVD copper seed layers in interconnect metallization was investigated for formation of a composite seed layer. Issues such as film stress, adhesion, electrical reliability, and hydrogen incorporation were addressed to determine feasibility of the...

  • Nanoparticle single-electron transistor with metal-bridged top-gate and nanogap electrodes. Azuma, Yasuo; Suzuki, Seiichi; Maeda, Kosuke; Okabayashi, Norio; Tanaka, Daisuke; Sakamoto, Masanori; Teranishi, Toshiharu; Buitelaar, Mark R.; Smith, Charles G.; Majima, Yutaka // Applied Physics Letters;8/15/2011, Vol. 99 Issue 7, p073109 

    Au nanoparticle single-electron transistors with metal-bridged top-gates and nanogap electrodes were fabricated using two consecutive electron beam lithography and electroless Au plating steps. The metal-bridged top-gate electrodes were suspended above electroless Au plated nanogap electrodes....

  • Coulomb blockade effects at room temperature in thin-film nanoconstrictions fabricated by a novel technique. Kubatkin, S. E.; Danilov, A. V.; Bogdanov, A. L.; Olin, H.; Claeson, T. // Applied Physics Letters;12/14/1998, Vol. 73 Issue 24 

    A technique was developed to fabricate and probe nanosize tunneling structures in thin metallic films. Using oblique evaporation through conventional undercut electron-beam lithographic masks, as the sample resistance was measured in situ, we defined constrictions with widths and lengths of...

  • Mechanism of electron-beam writing in passivated gold nanoclusters. Bedson, T. R.; Palmer, R. E.; Wilcoxon, J. P. // Applied Physics Letters;4/2/2001, Vol. 78 Issue 14, p2061 

    We have investigated the mechanism of direct electron-beam writing in thin films of passivated gold nanoclusters. The exposure of films of approximately monolayer thickness (6 nm) was investigated as a function of electron dose on various substrates. Films were obtained on various substrates:...

  • Spin-polarized current induced switching in Co/Cu/Co pillars. Grollier, J.; Cros, V.; Hamzic, A.; George, J. M.; Jaffres, H.; Fert, A.; Faini, G.; Ben Youssef, J.; Legall, H. // Applied Physics Letters;6/4/2001, Vol. 78 Issue 23, p3663 

    We present experiments of magnetization reversal by spin injection performed on pillar-shaped Co/Cu/Co trilayers. The pillars (200x600 nm[sup 2]) are fabricated by electron beam lithography and reactive ion etching. Our data for the magnetization reversal at a threshold current confirm previous...

  • Magnetic nanoparticle array with perpendicular crystal magnetic anisotropy. Haginoya, Chiseki; Heike, Seiji // Journal of Applied Physics;6/15/1999, Vol. 85 Issue 12, p8327 

    Presents information on a study which patterned a continued CoCrPt film with a perpendicular magnetic anisotropy into a magnetic nanoparticle array of Gdot/in... using electron beam lithography. Discussion on magnetic particle array; Experiment; Results and discussion; Summary.

  • Voids, Part 3. Carano, Michael // Printed Circuit Design & Manufacture;Aug2003, Vol. 20 Issue 8, p36 

    Presents information on preventing voids during electroless copper deposition in circuit boards. Reasons for the occurrence of voids in the electroless copper deposit; Parameters to monitor in copper deposition; Procedure in preventing voids.

  • Electroless polyol deposition and magnetic properties of nanostructured Ni[sub50]Co[sub50] films. Zhang, J. // Journal of Applied Physics;8/15/2000, Vol. 88 Issue 4, p2125 

    Investigates the electroless polyol deposition and magnetic properties of nanostructured nickel copper thin films. Advantages of electroless deposition of metal films; Relationship between film thickness and deposition time; Effect of increasing deposition time on crystallite size.

  • Positively charged surface potential of polymer films after excimer laser ablation: Application.... Niino, Hiroyuki; Yabe, Akira // Applied Physics Letters;5/25/1992, Vol. 60 Issue 21, p2697 

    Investigates the pulsed laser ablation of poly(ethylene terephthalate), polymide, and polyethersulfone films. Changes in the surface potential of the films; Deposition of cationic fragments onto the ablated areas; Execution of the electroless plating of copper or nickel.


Read the Article


Sorry, but this item is not currently available from your library.

Try another library?
Sign out of this library

Other Topics