Jumpering in Difficult Areas

Wong, Marvin; Yeh, Albert
January 2003
Circuits Assembly;Jan2003, Vol. 14 Issue 1, p42
Trade Publication
Evaluates printed circuits assembly (PCA) employing mechanical and electrical performance specifications. Problems faced during the production of PCA; Investigation of several potential techniques in the solution phase; Illustration of a ceramic ball grid array flex circuit patch assembly process.


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