TITLE

Rate-dependent indentation hardness of a power-law creep solder alloy

AUTHOR(S)
Ma, Xin; Yoshida, Fusahito
PUB. DATE
January 2003
SOURCE
Applied Physics Letters;1/13/2003, Vol. 82 Issue 2, p188
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
Berkovich depth-sensing indentation tests with different loading rates have been performed on a creep material, Sn-3.5Ag-0.75Cu solder alloy. The resulting indentation load-depth curves are rate dependent and have varying creep penetration depths during the same hold time. Creep indentation hardness H, defined from the concept of "work of indentation," varies with the volume strain occurring during the creep hold time, which is a measure of creep strain rate &epsilonl[sub cr]. Thus, rate sensitivity m of the indented material can be determined from the In H vs In ε[sub cr] curve. The derived value of m is consistent with the results from conventional uniaxial tensile and compression experiments of bulk solder alloy.
ACCESSION #
8858630

 

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