TITLE

Study of viscoplastic deformation in porous organosilicate thin films for ultra low-k applications

AUTHOR(S)
Zin, Emil H.; Bang, W. H.; Todd Ryan, E.; King, Sean W.; Kim, Choong-Un
PUB. DATE
June 2013
SOURCE
Applied Physics Letters;6/3/2013, Vol. 102 Issue 22, p221909
SOURCE TYPE
Academic Journal
DOC. TYPE
Article
ABSTRACT
This letter reports experimental observations evidencing the viscoplasticity of porous organosilicate glass thin films under conditions pertinent to their application in advanced low-k/Cu interconnect technology. Specifically, it is found that porous SiCOH thin films exhibit a significant level of viscoplasticity with a rate sensitive to the porosity, the degree of plasma damage, and hydration reaction when tested using a ball indenter at 150-400 °C. The activation energy of the viscosity (1.25-1.45 eV) is measured to be far lower than the bulk glass (>4 eV), suggesting that the viscous flow is affected by the presence of defective bond-network such as Si-OH or Si-H bonds.
ACCESSION #
88041276

 

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