Effect of back tension in multi-pass drawing on central bursting defect

Lee, S. W.; Kim, M. C.; Ryu, H. Y.; Joun, M. S.
May 2013
AIP Conference Proceedings;May2013, Vol. 1532 Issue 1, p988
Academic Journal
In this paper, effect of back tension in multi-pass drawing or wiredrawing on central bursting defect is investigated using finite element predictions of central bursting defect. A rigid-plastic finite element method is employed together with the McClintock damage model. Central bursting defects under different back tension stress values ranging from 0% to 20% of the yield strength of the material are predicted and they are compared to reveal the effect of the back tension stress values on the central bursting defects. It is shown that intensity of back tension has deep influence of cumulative damage and thus back tension raises the possibility of central bursting defect even though it decreases the interfacial stress between die and material.


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